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Products
Durable Dielectric Molding Compounds
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SolEpoxy continues to innovate thermoset epoxy formulations to achieve new standards of toughness, impact strength, and moisture resistance. Our molding compounds are an excellent choice for the most challenging environments where electrical devices are subject to corrosives, chemicals, heat and shock.
We have also developed "green" formulations with low thermoset temperatures and fast cure rates to lower the cost of molding.
Strengths: Moldability, Dielectric Strength, Temperature Stability, & "Green" Flame Retardants
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Unique Characteristics
SolEpoxy molding compounds are engineered for high glass transition temperature (Tg), and fire rated formulations are also available. Our molding compound products are characterized by:
- Excellent Electrical Insulation
- High Strength
- Excellent thermal shock resistance
- Meet and exceed automotive solvent resistance
- Easy molding characteristics
- Meet high temperature requirements - Class H and greater
- Capability to provide a range of thermal conductivity properties
Typical Applications
- Solenoid Coils
- High Voltage Equipment Bushings
- Sensors for Automotive and Proximity
- Actuators
- Reed Relays
- Electric Motors
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Products
- Sensor Grade Molding Powders
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MH20-01 – High Tg, high tensile and flex strength - general purpose compound featuring superior moldability.
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MG33F-0588 – Gold color, low CTE, fast cure, high performance material with low stress, good mold release.
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MG33F-0602 – Black color, long flow, high performance material with low stress, good mold release.
- Solenoid Coil Grade
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MH20-01 – High Tg, high tensile and flex strength - general purpose compound featuring superior moldability.
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GR2620 – High thermal conductivity and high Tg, with superior moldability.
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MH6-0508NF – High toughness and high flexibility as well as superior moldability.
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MH6-0504 – Excellent crack resistance, good moldability, tough, flexible and high strength.
- Bushing Grade
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MG6-0330 – Tough and flexible with high strength, designed specifically for bushings of all sizes.
- Actuator Grade
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MH20-01 – High Tg, high tensile and flex strength - general purpose compound featuring superior moldability.
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GR2620 – High thermal conductivity and high Tg, with superior moldability.
Methods of Molding
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SolEpoxy's molding powders are designed for the insulation and protection of electronic and electrical devices. They can be easily molded using the following methods:
- Conventional Transfer Molding Presses : The compounds are designed to mold easily, free of defects and with minimal mold cleaning. Our molding compounds are available in pellet form and granular powder, depending on the customers usage, with little or no dusting.
- Automold Transfer Molding : The compounds are designed for fast cycle time, easy molding, and minimal cleaning. They come in high quality pellet form designed to fit any automolding process.
- Injection Molding : Our compounds are epoxy based thermosetting plastics. They are designed for ease of processing and good barrel life. The material comes in granular form.
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