Durable Dielectric Molding Compounds
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SolEpoxy continues to innovate thermoset epoxy formulations to achieve new standards of toughness, impact strength, and moisture resistance. Our molding compounds are an excellent choice for the most challenging environments where electrical devices are subject to corrosives, chemicals, heat and shock.

We have also developed "green" formulations with low thermoset temperatures and fast cure rates to lower the cost of molding.

Unique Characteristics

SolEpoxy molding compounds are engineered for high glass transition temperature (Tg), and fire rated formulations are also available. Our molding compound products are characterized by:

  • Excellent Electrical Insulation
  • High Strength
  • Excellent thermal shock resistance
  • Meet and exceed automotive solvent resistance
  • Easy molding characteristics
  • Meet high temperature requirements - Class H and greater
  • Capability to provide a range of thermal conductivity properties

Typical Applications

  • Solenoid Coils
  • High Voltage Equipment Bushings
  • Sensors for Automotive and Proximity
  • Actuators
  • Reed Relays
  • Electric Motors
Aluminum Housed Resistors 
  • Maximizes pulse handling capability
  • The aluminum housing provides for superior heat conduction
  • Resistance to very tough environmental conditions.
Automotive Sensors & Stators 
  • Parts are often made of copper and nylon
  • Requires >1000 thermal cycles from -40C to 195C
  • Are regularly in contact with typical automotive fluids
Solenoid Valves 
  • Strong and tough with excellent thermal cycle / thermal shock performance
  • Excellent high temperature stability
  • Excellent color stability at operating temperatures
High Current Thermal Fuse 
High current thermal fuses (HCTF) are high current, high temperature operating devices that open automatically and disconnect the circuit if exposed above 235C. These are used primarily in automotive applications.

More complex than it looks, materials used for these devices must have very high thermal stability and pass stringent AEC-Q200 automotive specifications.
Large Bushing and High Voltage Applications 
SolEpoxy has been supplying epoxy mold compounds for the manufacture of large bushings for more than 30 years. Large bushings can require up to 5kgs of epoxy molding compound per shot for electrical insulation and protection.
Surface Mount Capacitors 
Trends in tantalum capacitor business continue to see an increase in molded chips and a decrease in both coated and through hole technology.

Surface mount capacitors are subject to lead-free soldering conditions and as such the mold compounds used should provide ever higher levels of MSL performance.
System in Package Encapsulation 
Different than semiconductor molding applications, system-in-package encapsulation requires the encapsulation of multiple components with varying sizes, geometries and complexities.

Molding compounds must be low stress encapsulants as well as be thermally conductive to dissipate the heat the devices generate.