Durable Dielectric Molding Compounds
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SolEpoxy continues to innovate thermoset epoxy formulations to achieve new standards of toughness, impact strength, and moisture resistance. Our molding compounds are an excellent choice for the most challenging environments where electrical devices are subject to corrosives, chemicals, heat and shock.

We have also developed "green" formulations with low thermoset temperatures and fast cure rates to lower the cost of molding.

Unique Characteristics

SolEpoxy molding compounds are engineered for high glass transition temperature (Tg), and fire rated formulations are also available. Our molding compound products are characterized by:

  • Excellent Electrical Insulation
  • High Strength
  • Excellent thermal shock resistance
  • Meet and exceed automotive solvent resistance
  • Easy molding characteristics
  • Meet high temperature requirements - Class H and greater
  • Capability to provide a range of thermal conductivity properties

Typical Applications

  • Solenoid Coils
  • High Voltage Equipment Bushings
  • Sensors for Automotive and Proximity
  • Actuators
  • Reed Relays
  • Electric Motors
Aluminum Housed Resistors 
  • Maximizes pulse handling capability
  • The aluminum housing provides for superior heat conduction
  • Resistance to very tough environmental conditions.
Automotive Sensors & Stators 
  • Parts are often made of copper and nylon
  • Requires >1000 thermal cycles from -40C to 195C
  • Are regularly in contact with typical automotive fluids
Solenoid Valves 
  • Strong and tough with excellent thermal cycle / thermal shock performance
  • Excellent high temperature stability
  • Excellent color stability at operating temperatures
High Current Thermal Fuse 
  • Strength after Thermally conductive > 2.7W/mK
  • Tg must be higher than 135C
  • CTE must be less than 20 ppm
Large Bushing and High Voltage Applications 
  • Epoxy Molding Compounds must have good high temperature stability
  • They must maintains color stability at high operating temperatures
  • SolEpoxy materials are proven compounds and have been used to make millions of bushings, and in some cases, requiring up to 5 kgs of material for a single mold shot
Surface Mount Capacitors 
  • Fast cure for high throughput
  • New materials are developed without halogens
  • CTE should be between 20-22ppm
System in Package Encapsulation 
  • Thermal conductivity: ≥ 2.5 W/m∙K
  • Glass Transition Temperature (Tg) must be higher than 135C
  • CTE must be lower than 20ppm/C